 Model Number |
CHJ-205A, 205, 206, 2510S, JGK-2538 |
Polymide Tape is a Kapton (Registered Trademark of DuPont) Polyimide Film tape with a silicon adhesive.
It retains it's excellent physical and electrical properties over a wide temperature range up to 240°C, especially suitable for the high temperature application of PCB plating, Transformer, coil and capacitors.
Specification
|
Part №
|
CHJ-205A
|
|
Base Material
|
Polyimide Film
|
|
Thickness
|
Overall : 0.055 mm(±0.005)
|
|
Baking : 0.025 mm(±0.002)
|
|
Adhesive: 0.030 mm(±0.005)
|
|
Adhesive
|
Silicon
|
|
Standard Length
|
33 M
|
|
Standard Width
|
660 mm
|
|
Color
|
Transparent Brown
|
|
Adhesive Strength (gf/In)
|
570(±0.005)
|
|
Tensile Strength ( Mpa)
|
MD ≥ 188 TD ≥187
|
|
Elongation at Break (%)
|
MD ≥88, TD ≥87
|
|
Volume Resistivity(Ω,m)
|
20°C±5°C, 4.7 x 10?#8308;
|
|
Surface Resistivity (Ω)
|
20°C±5°C, 3.9 x 10?#8308;
|
|
Relative dielectric cons(48-62Hz≤3.9)
|
≤ 2.7
|
|
Temperature(°C)
|
240 °C(±0.005)
|
|
Flame Retardancy
|
YES
|
|
Application
|
PCB MASKING (Gold Plating,HSAL) Transformer, Coil, Capacitors
|
|
Remark
|
UL FILE NO.E231034
|
|
Part №
|
CHJ-205
|
|
Base Material
|
Polyimide Film
|
|
Thickness
|
Overall : 0.075 mm(±0.005)
|
|
Baking : 0.025 mm(±0.002)
|
|
Adhesive: 0.050 mm(±0.005)
|
|
Adhesive
|
Silicon
|
|
Standard Length
|
33 M
|
|
Standard Width
|
660 mm
|
|
Color
|
Transparent Brown
|
|
Adhesive Strength (gf/In)
|
950(±0.005)
|
|
Tensile Strength ( Mpa)
|
MD ≥ 188 TD ≥187
|
|
Elongation at Break (%)
|
MD ≥88, TD ≥87
|
|
Volume Resistivity(Ω,m)
|
20°C±5°C, 4.7 x 10?#8308;
|
|
Surface Resistivity (Ω)
|
20°C±5°C, 3.9 x 10?#8308;
|
|
Relative dielectric cons(48-62Hz≤3.9)
|
≤ 2.7
|
|
Temperature(°C)
|
240 °C(±0.005)
|
|
Flame Retardancy
|
YES
|
|
Application
|
PCB MASKING (Gold Plating,HSAL) Transformer, Coil, Capacitors
|
|
Part №
|
CHJ-206
|
|
Base Material
|
Polyimide Film
|
|
Thickness
|
Overall : 0.060 mm(±0.005)
|
|
Baking : 0.025 mm(±0.002)
|
|
Adhesive: 0.035 mm(±0.005)
|
|
Adhesive
|
Silicon
|
|
Standard Length
|
33 M
|
|
Standard Width
|
660 mm
|
|
Color
|
Transparent Brown
|
|
Adhesive Strength (gf/In)
|
650(±0.005)
|
|
Tensile Strength ( Mpa)
|
MD :196, TD :167
|
|
Elongation at Break (%)
|
MD :81, TD :88
|
|
Volume Resistivity(Ω,m)
|
≥ 1.0 x 10E10
|
|
Surface Resistivity (Ω)
|
≥ 1.0 x 10E?
|
|
Relative dielectric cons(48-62Hz≤3.9)
|
≥ 160
|
|
Temperature(°C)
|
200 °C(±0.005)
|
|
Flame Retardancy
|
YES
|
|
Application
|
PCB MASKING (Gold Plating, HSAL)
|
CHJ-2510S
Product Description
CHJ-2510s Single Coated Polyimide Tape With Liner.
Polyimide film tape, single coated with a silicone adhesive.
|
Classification
|
Unit
|
Typical Values
|
Tolerance
|
Remarks
|
|
Backing thickness
|
㎛
|
25
|
23-27
|
ASTM D3652
|
|
Adhesive thickness
|
㎛
|
25
|
23-27
|
ASTM D3652
|
|
Total thickness
|
㎛
|
50
|
48-52
|
ASTM D3652
|
|
Liner description
|
|
Glassine Paper
|
|
-
|
|
Color
|
|
Transparent Brown
|
|
-
|
|
Adhesive to steel
|
gf/in
|
830
|
800-850
|
ASTM D3330
|
|
Tensile strength
|
Mpa≥140
|
MD196,TD167
|
± 2
|
ASTM D3759
|
|
Elongation
|
% ≥45
|
MD81, TD88
|
± 2
|
ASTM D3759
|
|
Dielectric breakdown
|
kv
|
5kv
|
4.8-5.2
|
ASTM D149
|
|
Electrical resistance
|
Ω
|
N.A
|
N.A
|
ASTM D259
|
|
Temperature
|
°C
|
200
|
|
-
|
Typical Applications
Protect specific areas of a PCB. Masking of connectors and circuitry during PCB chemical processing such as tin lead stripping and gold finger plating.
Features and Benefits
Excellent good solvent and high thermal resistance.
Good dimensional stability.
CHJ-2538
Product Description
JGK - 2538 Single Coated Polyimide Tape With Liner.
Polyimide film tape, single coated with a silicone adhesive.
|
Classification
|
Unit
|
Typical Values
|
Tolerance
|
Remarks
|
|
Total thickness
|
㎛
|
40
|
38-43
|
ASTM D3652
|
|
Backing thickness
|
㎛
|
25
|
23-28
|
ASTM D3652
|
|
Adhesive thickness
|
㎛
|
15
|
13-18
|
ASTM D3652
|
|
Liner description
|
㎛
|
Glassine Paper
|
|
-
|
|
Color
|
|
Brown
|
|
-
|
|
Adhesive to steel
|
gf/in
|
80
|
78-82
|
ASTM D3330
|
|
Tensile strength
|
Mpa
|
MD:192, TD:165
|
± 2
|
ASTM D882
|
|
Elongation
|
%≥55%
|
MD:64%, TD:78%
|
± 2
|
ASTM D882
|
|
Volume resistivity
|
Ω,m
|
≥1*10(18)Ω.cm
|
Pass
|
ASTM D149
|
|
Surface resistivity
|
Ω
|
≥1*10(15)Ω
|
Pass
|
ASTM D259
|
|
Temperature
|
°C
|
240
|
|
-
|
Typical Applications
Protect specific areas of a PCB. Masking of connectors and circuitry during PCB chemical processing such as tin lead stripping and gold finger plating.
Features and Benefits
Excellent good solvent and high thermal resistance.
Good dimensional stability.
|
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